Advances in Electronic Circuit Packaging: Volume 3
Advances in Electronic Circuit Packaging: Volume 3 by Lawrence L. Rosine (Editor, EDN (Electrical Design News))
English | PDF | 1963 | 463 Pages | ISBN : 148997296X | 47.3 MB
The Third International Electronic Circuit Packaging Symposium was unique in a number of ways, particularly in its scope and in the approach taken in some of the presentations. For instance, one of the particularly interesting papers was "Design- ing and Packaging Electronic Modular Enclosures That Never Leave the Ground." Here we were shown how a large system console could be packaged to meet the "convenience" needs of the operator. Thus, personnel considerations became impor- tant in the package and one of the determining factors in the design.
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