Autodesk Inventor Nastran 2025.3.0 | 1.1 Gb
Autodesk has announced the release of Inventor Nastran 2025.3.0 is delivers finite element analysis (FEA) tools for engineers and analysts. Simulation covers multiple analysis types, such as linear and non-linear stress, dynamics and heat transfer.
Autodesk Inventor Nastran, a CAD-embedded finite element analysis (FEA) tool powered by the Autodesk Nastran solver, offers a wide range of simulation spanning across multiple analysis types such as linear and nonlinear stress, dynamics, and heat transfer. It provides a consistent user experience and eliminates the need for multiple single-platform simulation technologies. Inventor Nastran delivers high-end simulation technology in an affordable subscription to the Product Design & Manufacturing Collection.
Getting Started with NASTRAN
The first steps taken tend to set the tone of the journey. Learn how to start the Autodesk NASTRAN journey in this introductory webinar.
Autodesk helps people imagine, design and create a better world. Everyone—from design professionals, engineers and architects to digital artists, students and hobbyists—uses Autodesk software to unlock their creativity and solve important challenges.
Owner: Autodesk Inc.
Product Name: Inventor Nastran
Version: 2025.3.0
Supported Architectures: x64
Website Home Page : www.autodesk.com
Languages Supported: multilanguage
System Requirements: Windows *
Size: 1.1 Gb
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